Interlace Showcases "Capital Agility" at Hong Kong FinTech Week 2025
Hong Kong FinTech Week 2025, a prominent fintech event in Asia, took place from November 3–7, 2025, in Hong Kong.
The conference featured dedicated forums on Web3 and digital finance, bringing together global leaders to discuss the future of artificial intelligence, blockchain, and digital assets.
As part of the Finternet Committee 2025, Interlace, a leading global card issuance and treasury management platform, participated in the conversation.
Interlace COO Henry Chan spoke alongside industry leaders from Tether, Morph, Banxa, and Aptos, discussing
The Digital Bridge: Stablecoins, Commerce, and the Future of Payment Experience.
Author's summary: Interlace joins Hong Kong FinTech Week 2025 to discuss digital payment future.
- Event: Hong Kong FinTech Week 2025
- Location: Hong Kong
- Dates: November 3–7, 2025
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